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[News Feature]
IT’S A PACKAGE DEAL: INFINEON GRABS DIIRREECCTTFET LICENSING
Staff
ED Online ID #17868
October 25, 2007
Neubiberg, Germany and El
Segundo, Calif., USA:
International Rectifier and
Infineon Technologies reached
an agreement whereby Infineon
will license International
Rectifier’s patented power-management
packaging technology
called DirectFET.
Designed for use in ac-dc and
dc-dc power-conversion applications
in computers, notebooks,
telecommunications, and consumer
electronics devices, the
DirectFET power package is a surface-
mount power MOSFET packaging
technology for efficient topside
cooling in an SO-8 footprint
or smaller. Compared to standard
plastic discrete packages,
DirectFET’s metal can construction
enables dual-sided cooling to
effectively double the current handling
capacity of high-frequency
dc-dc buck converters.
Infineon will deploy the
DirectFET power package technology
with its OptiMOS 2 and
OptiMOS 3 chip technology.
The company expects to sample
the OptiMOS 2 in DirectFET
packages early next year.
Emerson to buy Motorola’s
ECC business
St. Louis, Mo., and Schaumburg,
Ill., USA: Upon reaching an
agreement, Emerson announced
that it will acquire Motorola’s
Embedded Communications
Computing (ECC) business for
$350 million in cash. Motorola’s
ECC business had 2006 revenues
of approximately $520
million in 2006.
Once the transaction is completed,
Motorola’s ECC business
will become part of Emerson
Network Power. The transaction
is expected to be completed by
the end of this year and is subject
to customary closing conditions
and regulatory approvals.
Motorola’s ECC business,
which is based in Tempe,
Arizona, USA, has approximately
1100 employees. The business
has driven open standards
and pioneered technologies
based upon them since it was
formed back in 1980.
For Emerson, the transaction
enhances its ability to meet the
embedded computing needs of
customers in telecommunications
and other industries. For
Motorola, the transaction sharpens
its focus on its core businesses
and technologies and provides
additional capital to drive
further growth and enhance
shareholder value.
“We are excited to add
Motorola’s Embedded
Communications Computing business to the Emerson portfolio
of businesses,” says David N.
Farr, chairman, chief executive
officer, and president of
Emerson. “The combination
of
Motorola’s ECC
business with the
$100 million
embedded computing business
we acquired as part of
Artesyn last year establishes
Emerson as a leader in the
embedded computing industry.
Through this transaction,
Emerson can provide greater
capabilities to our customers as
they adopt advanced new technologies
and expand applications
for their customers.”
Emerson Network Power and
Motorola ECC embedded computing
technologies feature the
Advanced Telecommunications
Computing Architecture
(AdvancedTCA) and Micro
Telecommunications Computing
Architecture (MicroTCA) industry
standards. Major telecom companies
have adopted these standards
because of their ability to
increase network capacity while
lowering the total cost of ownership,
says Emerson.
Board-to-board converters...
3 million and counting
Stockholm Sweden: Ericsson
Power Modules recently shipped
its three-millionth board-to board
dc-dc converter.
Ericsson introduced this technology
in 2004. Since then, the
reduced use of epoxy mouldings,
ceramic substrates, and
leadframes, along with the use
of lower thermodynamic subassemblies,
has contributed to
cutting the board-to-board modules’
mass by 30%. This means
they require less energy during
the manufacturing process and
when being assembled into customers’
equipment.
Safety platform expands
protocol options
Oxfordshire, England: Green
Hills Software announced its collaboration
to add support for
CANopen, IEEE 1588, and
EtherNet/IP protocols to the
company’s Platform for
Industrial Safety. These protocols
can now execute safely and
reliably when combined with
Green Hills Software’s RTOS.
“Freescale’s 32-bit
PowerQUICC processors work
with proven device software
optimisation technology from
Green Hills to enable creation of
world-class industrial automation,
medical, avionics, and
defence products that run some
of the most demanding protocols
in the industry,” says Glenn
Beck, industrial marketing manager
for Freescale.
“With this expanded support,
Freescale Semiconductor and
Green Hills Software are in a
position to further reduce product
time-to-market while increasing
device reliability.”
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